============================================================================= Intel(R) Server Platforms Riggins 6BP RELEASE NOTES ============================================================================= INTEL Enterprise Platform & Services Marketing Intel Corporation 2111 N.E. 25th Avenue, Hillsboro, OR 97124 USA ============================================================================= DATE: Oct 08, 2009 TO: Intel(R) Hot-swap Backplane AXX6DRV3G, Intel(R) Server Board S3210SH/S3200SH Customers SUBJECT: AXX6DRV3G (6BP) HSC v2.12 Release Notes ============================================================================= LEGAL INFORMATION ============================================================================= Information in this document is provided in connection with Intel Products and for the purpose of supporting Intel developed server boards and systems. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Intel is a registered trademark of Intel Corporation. *Other names and brands are the property of their respective owners. Copyright (c) 2009 Intel Corporation. ============================================================================= RELEASE PACKAGE CONTENTS ============================================================================= The following files are included in this release package: - RG6BP212.hex (HSC v2.12 main image file) - FWPIAUPD.EFI (EFI Utility to update HSC FW) - IPMI.EFI - README.txt (HSC v2.12 release notes) - EFIUPFW (Batch file to update HSC FW in EFI shell) ============================================================================= ABOUT THIS RELEASE ============================================================================= REVISION INFORMATION RETURNED BY GET DEVICE ID COMMAND: Firmware Version: v2.12 Manufacturer ID: 0x0157 (Intel) Product ID: 0x0A08 (6BP) Checksum Information: Boot Code: 0x00000000 -> 0x00024499 Boot code checksum : 0x00A027EC File Checksum: 0x0D9327EC ============================================================================= SYSTEM SOFTWARE REQUIREMENTS/REVISIONS ============================================================================= - BMC revision: BMC 35 or later - BIOS revision: BIOS 49 or later - FRUSDR 1.14 or later ============================================================================= IMPORTANT INSTALLATION NOTES ============================================================================= - All the files listed in the RELEASE PACKAGE CONTENTS section are required to update the firmware and perform various other important functions. - This package is only for servers based on Intel(R) Server Board S3210SH/S3200SH. ============================================================================= INSTALLATION PROCEDURES -- ============================================================================= ** Note: For power-on, no firmware update utility is provided. It is assumed that the factory will flash the provided hex image directly to the SEEPROM. Firmware Installation Procedure (Requires HSC firmware already running): 1) Boot to EFI, and change directories to the release directory. 2) Run the provided NSH file. 3) The HSC will receive a boot code update. This could take up to 20 minutes to upload and verify. 4) After verification, the firmware requires 60 seconds to finish updating. The front-panel power and reset buttons will be placed in secure mode during this time. Any attempts to access these buttons will result in security violation entries in the system event log. Please do not reset or remove power from the system during this time as any interruption could leave the HSC inoperable. 5) Please update your BMC's SDR package to the latest version. 6) Please reboot your system. ============================================================================= ISSUES FIXED ============================================================================= v2.12 - Set temperature offset for SES-2 v2.11 - None v2.10: - Fix: HSC misses some SES2/I2C requests causing system crashes v2.09: - None v2.08: - None v2.07: - None v2.05: - Read Enclosure Status (SAF-TE) returns undefined bytes - Fault LEDs on S5000 family platform Non Expander Backplane Blinking on wrong slots v2.02: - Get Fault Status - Set Sensor Hysteresis command returns 0x00 even when incorrect reserved byte is set - Set Sensor Event Enable IPMI command returns successful completion code even went issued with incorrect number of parameters - Perform Slot Operation SAF-TE command sets the wrong flag - Set sensor event enable responding wrong value. - Wrong and no SAS drive detection SEL events - Read Device Slot Status does not report Prepare For Insertion Or Removal Flag - Read Device Slot Status SAF-TE command does not report an unconfigured Drive [END OF RELEASE NOTES]