============================================================================= Intel(R) Hot-swap Backplane AXX6DRV3GR (6BPR) HSC 6BP RELEASE NOTES ============================================================================= INTEL Enterprise Platform & Services Marketing Intel Corporation 2111 N.E. 25th Avenue, Hillsboro, OR 97124 USA ============================================================================= DATE: Oct 30, 2009 TO: Intel(R) Hot-swap Backplane AXX6DRV3GR, Intel(R) Server Boards S5520HC, S5520HCT, S5500HCV and Intel(R) Workstation Board S5520SC Customers SUBJECT: AXX6DRV3GR (6BPR) HS v2.12 Release Notes ============================================================================= LEGAL INFORMATION ============================================================================= Information in this document is provided in connection with Intel Products and for the purpose of supporting Intel developed server boards and systems. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Intel is a registered trademark of Intel Corporation. *Other names and brands are the property of their respective owners. Copyright (c) 2006 Intel Corporation. ============================================================================= RELEASE PACKAGE CONTENTS ============================================================================= The following files are included in this release package: - RG6BP212.hex (HSC v2.12 main image file) - RG6BP212.bin (BIN file) - FWPIAUPD.EFI (EFI Utility to update HSC FW) - IPMI.EFI - README.txt (HSC v2.12 release notes) - EFIUPFW ((Batch file to update HSC FW in EFI shell) ============================================================================= ABOUT THIS RELEASE ============================================================================= REVISION INFORMATION RETURNED BY GET DEVICE ID COMMAND: Firmware Version: v2.12 Manufacturer ID: 0x0157 (Intel) Product ID: 0x0A08 Checksum Information: Boot Code: 0x00000000 -> 0x00024499 Boot code checksum : 0x00A027EC File Checksum: 0x0D9327EC ============================================================================= SYSTEM SOFTWARE REQUIREMENTS/REVISIONS ============================================================================= - S5500 Series Board BMC revision: BMC 43 or higher - S5500 Series Board BIOS revision: R0035 BIOS or higher - FRUSDR (S5500 Series Board) S5520HC/S5520HCT/S5500HCV - FRUSDR 10 or higher ============================================================================= IMPORTANT INSTALLATION NOTES ============================================================================= - The following files are necessary to update the firmware: *** All the files listed in the RELEASE PACKAGE CONTENTS section are required to update the firmware and perform various other important functions. *** - For S5500 Series Board only EFI shell update is supported ============================================================================= INSTALLATION PROCEDURES -- ============================================================================= ** Note: For power-on, no firmware update utility is provided. It is assumed that the factory will flash the provided hex image directly to the SEEPROM. Primary Installation Procedure (Requires HSC firmware already running): ** The firmware update utility is available. Before using the utility to update,v1.32 firmware should be programmed first time using programmer using the HEX file given with the package.While using the FWPIAUPD utility -nopc option is a must. Firmware Installation Procedure (Requires HSC firmware already running): 1) Unzip the release package, and copy the contents onto Win98 DOS bootable media (such as a bootable USB memory device) only for DOS mode update. 2) Boot to Dos/EFI, and change directories to the release directory. 3) Run the provided run.bat/run.sh file. 4) The HSC will receive a boot code update. This could take up to 13 minutes to upload and verify. 5) After verification, the firmware requires 60 seconds to finish updating. The front-panel power and reset buttons will be placed in secure mode during this time. Any attempts to access these buttons will result in security violation entries in the system event log. Please do not reset or remove power from the system during this time as any interruption could leave the HSC inoperable. 6) Please update your BMC's SDR package to the latest version. 7) Please reboot your system. ============================================================================= KNOWN ISSUES/WORKAROUNDS ============================================================================= v2.12: - None v2.11: - None v2.10: - None. v2.09: - FP LED going Amber blinking for Drive Fault doesn't work. - HSC update takes around 25mins to update because of 16 bytes updates. - EFI FWPIAUPD 4.0.2 Build 3 doesn't work for HSC update. Please use the one provided with the package. - Due to known HW issue Fab 1 BP's fails to light up HDD LED 4 & 5. ============================================================================= ISSUES FIXED ============================================================================= v2.12: - Does HSC have +20 degree temperature offset for SES-2 v2.11 None v2.10: - HSC misses some SES2/I2C requests causing system crashes v2.09: - None [END OF RELEASE NOTES]