The products you are looking for are no longer manufactured by Intel. Additionally, Intel no longer provides interactive support for these products via telephone or e-mail, nor will Intel provide any future content updates or software updates to support new operating systems or improve compatibility with third party devices and software products.
THESE PRODUCT SUPPORT DOCUMENTS ARE PROVIDED FOR HISTORICAL REFERENCE ONLY AND ARE SUBJECT TO THE TERMS SET FORTH IN THE "TERMS OF USE" INFORMATION.
Information on currently available Intel products is available at www.intel.com and/or developer.intel.com
- Software and Drivers
-
- Download (Bootable Version) - Intel® Processor Frequency ID Utility
-
Version 7.2
The bootable version of the Intel® Processor Frequency ID Utility is available in .exe format. This download does not work in DOS-emulation windows, as found in operating systems such as Linux*. Since this version is bootable, it does not depend on any specific operating system (OS independent).
See the Installation Guide for detailed instructions on how to use this utility.
Which Utility Should I Use?
For Intel® Pentium® III processors, and processors manufactured before the Intel® Pentium® III processor, use the Intel® Processor Frequency ID Utility.
- Download (Windows* Version) - Intel® Processor Frequency Utility
-
Version 7.2
The utility is available for download in a self-installing .msi file format.
- Supported Processors
- Supported Operating Systems
You must have system administrative rights for successful installation on Windows XP* and Windows 2000*.Note There are two processor identification utilities used to identify Intel® processors. The Intel® Processor Identification Utility is the newest identification utility. Before downloading either utility, review the supported processors list to see the processors supported by each utility.
- Frequency Test Tab
-
The Frequency Test Tab can provide information regarding the operating status of the tested processor or system bus. It will report:- Proper Intel® processor brand identification
- Processor and system bus expected frequencies
- Processor and system bus reported frequencies
- Accompanying this information is a message informing the user whether the processor is operating at its expected frequency
- Which processor was tested in a multiprocessor system, and total number of processors (Windows* XP, and Windows* 2000 only)
- Intel® Processor Frequency ID Utility for Windows*
-
The CPUID Utility for Windows* is incorporated into the Intel® Processor Frequency ID Utility.
Use the CPUID Data Screen of the utility to identify Pentium® processors and higher.
- Supported operating systems for the Intel® Processor Frequency ID Utility
-
Operating System
- Windows 98* SE
- Windows 2000* Professional, Server, Advanced Server
- Windows Me*
- Windows XP*
Note Windows 95*, Windows 98, Windows NT* 3.51, and Windows NT 4.0 are no longer supported. Use bootable version of the Intel Processor Frequency ID Utility for systems which have Windows 95 or Windows NT 3.51 installed.
- Intel® Processor Identification Utility download for Windows*
-
This utility is designed to identify current Intel® Processors and technologies, and enables you to run and save a processor ID report. The utility also features a frequency test to make sure that the processor is working at the tested and rated speed.
The Intel® Processor Identification Utility video walks you through download to installation, and provides an overview of the most common technologies supported by the processor.
The latest version of Intel® Processor Identification Utility is available for download in a self-installing .msi file format.
Note Microsoft Windows XP* and Microsoft Windows 2000* users must have system administrator rights to install the utility.
- Compatibility
-
- What is a processor core stepping?
-
The first version of a new microprocessor product is the A-0 core step. Later, as improvements are made to the product for functional fixes or manufacturing improvements, the core stepping number is incremented. Generally speaking, minor changes result in an increased number (i.e. A-3 to A-4), while more complex changes result in the letter being changed (i.e. A-3 to B-0). Note that a B-0 core stepping is more recent than an A-4 core stepping.
- Which Intel® chipsets are validated for Pentium® III Xeon® Processors?
-
Pentium® III Xeon Processors at 1.0 GHz, 933 MHz, 800 MHz, 733 MHz, 667 MHz, and 600 MHz operating on a 133 MHz system bus, in 2-way configurations are validated with the Intel® 840 Chipset.
Pentium III Xeon Processors 700 MHz operating on a 100 MHz system bus, in 4-way configurations are validated with the Intel® 450NX PCIset.
Pentium III Xeon Processors 550 MHz, and 500 MHz operating on a 100 MHz system bus, in 4-way configurations are validated with both Intel® 440GX AGPset and the Intel 450NX PCIset.
- Certain Pentium® III Xeon® processors have been validated
-
Only certain Pentium® III Xeon® processors have been validated for the Intel® SBT2 Server Board.
Boxed Pentium® III Xeon® processors with product code BX80526KB866256, BX80526KB933256 and BX80526KB001256 use a special heatsink thermal solution only recommended for use with the Intel® SBT2 server board.
Only certain Pentium® III Xeon® processors have been validated for the Intel® SBT2 Server Board.
Boxed Pentium® III Xeon® processors with product code BX80526KB866256, BX80526KB933256 and BX80526KB001256 use a special heatsink thermal solution only recommended for use with the Intel® SBT2 server board.
- Identify Products
-
- Identifying your processor
-
Software utility
The Intel® Processor Frequency ID Utility was developed by Intel Corporation to enable consumers with the ability to identify and in some circumstances determine if their Intel processor is operating at the rated frequency intended by Intel Corporation. Beginning with the Pentium® III processor, the Intel Processor Frequency ID Utility has the capability to provide actual and intended frequency, or speed, information.
Web resources
The Specification Update and Product Specifications and Comparisons are resources which contain information about the different steppings and versions of processors. If you need information about the voltage, thermal specifications, the processor packaging, or other information about a particular Pentium III processor, you will need to view the part numbers on your processor and compare that information with the Specification Update or the Product Specifications and Comparisons tool.
The Specification Update is a document that has more complete information, but the Product Specifications and Comparisons tool may be a bit easier to use.
The Product Specifications and Comparisons tool was designed as a reference to help you look up technical spec information on your Intel® processor. To find the information that you are looking for, you will need to know your processor's sSpec number.
Package markings: single edge contact cartridge (S.E.C.C.)
The Pentium III processor's S.E.C.C. cartridges have laser etched markings that indicate the processor's core speed, L2 cache size, S-spec number, serialization code, and country of origin. The markings are located on top of the cartridge. Refer to the Specification Update for more details.
- Boxed Product Order Codes
-
Speed/Features Single Pack Product Order Codes *866MHz (256K cache/133 MHz FSB) *BX80526KB866256 *933MHz (256K cache/133 MHz FSB) *BX80526KB933256 500MHz (1 MB cache/100 MHz FSB) BX80525KY5001M 500MHz (2 MB cache/100 MHz FSB) BX80525KY5002M 500MHz (512KB cache/100 MHz FSB) BX80525KY500512 550MHz (1 MB cache/100 MHz FSB) BX80525KY5501M 550MHz (2 MB cache/100 MHz FSB) BX80525KY5502M 550MHz (512KB cache/100 MHz FSB) BX80525KY550512 600MHz (256K cache/133 MHz FSB) BX80526KZ600256 667MHz (256K cache/133 MHz FSB) BX80526KZ667256 700MHz (1 MB cache/100 MHz FSB) BX80526KY7001M 700MHz (2 MB cache/100 MHz FSB) BX80526KY7002M 733MHz (256K cache/133 MHz FSB) BX80526KZ733256 800MHz (256K cache/133 MHz FSB) BX80526KZ800256 866MHz (256K cache/133 MHz FSB) BX80526KZ866256 900MHz (2 MB cache/100 MHZ FSB) BX80526KY9002M 933MHz (256K cache/133 MHz FSB) BX80526KZ933256 *1.0 GHz (256K cache/133 MHz FSB) *BX80526KB001256 *Boxed Pentium® III Xeon® processors with product code BX80526KB866256, BX80526KB933256 and BX80526KB001256 use a special heatsink thermal solution only recommended for use with the Intel® SBT2 server board.
- Intel® desktop processors package type guide
-
This document describes the various desktop processor package types.
FC-LGAx package type
The FC-LGAx package is the latest package type used with the current family of desktop processors going back to the Intel® Pentium® 4 processors designed for the LGA775 socket and extending to the Intel® Core™i7-2xxx series processors designed for the LGA1155 socket. FC-LGA is short for Flip Chip Land Grid Array x. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number x stands for the revision number of the package.This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink. You may also see references to processors in the 775-LAND or LAG775 package. This refers to the number of contacts that the package contains that interface with the LGA775 socket.
Current socket types that are used with the FC-LGAx Package types are LGA775, LGA1366 and LGA1156. Sockets are not interchangeable and must be matched to motherboards for compatibility. (Motherboard BIOS support for processors is also required for compatibility.)
LGA775 socket (2004)
The pictures below may include the LAND Side Cover (LSC). This black cover is no longer being used.
Photo examples
(Front side) (Back side)LGA1366 socket (2008)
Photo examples
(Front side) (Back side)LGA1156 socket (2009)
Photo examples
(Front side) (Back side)LGA1155 socket (2011)
Photo examples
(Front side) (Back side)LGA1150 socket (2013)
Photo examples
(Front side) (Back side)
FC-PGA2 package type
FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).Pentium 4 processor
Photo examples
(Front side) (Back side)Pentium III and Intel® Celeron® Processor
Photo examples
(Front side) (Back side)
FC-PGA package type
The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.Photo examples
(Front side) (Back side)
OOI package type
OOI is short for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.Photo examples
(Front side) (Back side)
PGA package type
PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon® processor, which has 603 pins.Photo examples
(Front side) (Back side)
PPGA package type
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.Photo examples
(Front side) (Back side)
S.E.C.C. package type
S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses gold finger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon® and Pentium III Xeon processors, which have 330 contacts.Photo examples
(Front side) (Back side)
S.E.C.C.2 package type
The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).Photo examples
(Front side) (Back side)
S.E.P. package type
S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to an S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 242 contacts.Photo examples
(Front side) (Back side)
- Documents and Guides
-
- Thermal Management
-
Introduction
This document is written for professional system integrators building PCs from industry-accepted motherboards, chassis, and peripherals. It provides information and recommendations for thermal management in systems using boxed Pentium® III Xeon® processors.
It is assumed that the reader has a general knowledge of and experience with workstation and server operation, integration, and thermal management. Integrators who follow the recommendations presented here can provide their customers with more reliable systems and will see fewer customers returning with problems. (The term "boxed Pentium III Xeon processors" refers to processors packaged for use by system integrators.)
Thermal management
All systems using Pentium III Xeon processors require thermal management. In this case, "thermal management" includes three major elements: (1) a heatsink properly mounted to the processor, (2) local airflow to transfer the heat to the chassis air, and (3) airflow to evacuate the heated air from the chassis. The ultimate goal of thermal management is to keep the processor at or below its maximum operating temperature. Table 1 shows the maximum operating temperatures of specific Pentium III Xeon processors. The maximum operating temperature is measured at the center of the surface of the processor's thermal plate and varies depending on the particular frequency and stepping of the processor.
Table 1. Boxed Pentium® III Xeon® Processor information
Processor Core Frequency and L2 Cache Size (MHz/Bytes) Boxed Pentium III Xeon Processor Stepping Maximum Thermal Plate Temp (°C) Power Dissipation (W) 500/512KB C0 75 36.0 500/1MB CO 75 44.0 500/2M C0 75 36.2 550/512K CO 68 34.0 550/1MB C0 68 34.0 550/2MB CO 68 39.5 600/256K A2 55 21.6 667/256K A2 55 23.9 700/1M A1 65 32.0 700/2M A1 65 32.0 733/256K A2 55 26.2 800/256K A2 55 28.5 866/256K B0 55 30.8 933/256K B0 55 33.2 1000/256K C0 55 34.6
Proper thermal management is achieved when heat is transferred from the processor to heatsink, from the heatsink to the chassis air, and from the inside the chassis to the outside. Boxed Pentium III Xeon processors are shipped with an attached high-quality heatsink, which can effectively transfer processor heat to the system air. It is the responsibility of the system integrator to ensure good system airflow to remove the heat from the heatsink, and from the chassis to the outside air
This document makes recommendations for achieving good system airflow.
Integrated heatsink
The boxed Pentium III Xeon processor is shipped with an attached high quality heatsink. Figure 1 shows the processor and heatsink.
Figure 1: Boxed Pentium® III Xeon® Processor and Heatsink
The heatsink that ships with the boxed Pentium III Xeon processor has already been securely attached to the processor. A small amount of thermal grease (already applied), or thermal interface film, provides effective heat transfer from the processor to the heatsink. Even though the heatsink is attached with normal screws, the heatsink should never be removed. Removing the heatsink will void the processor warranty. The thermal interface material (grease or film) has been efficiently placed and may not achieve the same efficiency if the heatsink is removed and replaced
The heatsink design allows heat to transfer from the processor, through the thermal interface material, through the heatsink base, and up each of the heatsink fins. Airflow around the fins carries the heat off the fins and into the chassis interior. The heatsink is designed for maximum efficiency when air flows either horizontally or vertically cross the heatsink. In some cases, air can be blown directly into the middle of the heatsink, provided that the exiting air is eventually removed form the chassis. The system integrator is responsible for removing the heat from the heatsink fins with localized airflow.
Creating localized airflow across the heatsink
Localized airflow refers to an appropriate amount of air flowing across or into the heatsink to transfer heat from the heatsink fins to the internal chassis air. There are three methods of achieving proper localized airflow on a boxed Pentium III Xeon processor:- Chassis fans can create high enough airflow through the chassis, or through the processors with ducting, to eliminate the need for localized airflow.
- Fans placed close to the processor can draw air vertically or horizontally across it.
- An auxiliary fan can be attached to the heatsink face to remove the heated air.
If the chassis fans do not create enough airflow across the processors, or do not employ ducting, localized airflow may be absolutely necessary. Localized airflow can be created using fans that attach to special chassis brackets, retention mechanisms, or the heatsink itself. Some chassis may have brackets next to or on top of the processors that are designed to hold fans that direct air locally across the processor heatsinks. Make sure chassis such as these will work with your motherboard design.
Some retention mechanisms supplied with Pentium III Xeon processor based motherboards provide locations for mounting small fans that draw air across the heatsink. Figure 2 shows an example of a second Pentium III Xeon processor being installed in a dual retention mechanism (DRM). In this example, two small fans are installed in the DRM. The fans ensure adequate airflow is directed through the second processor's heatsink.
Figure 2: Boxed Pentium® III Xeon™ Processor being installed into dual retention mechanism (DRM)Note that, unlike the second processor, the first processor has no fans directly drawing air across its heatsink. Thus, the chassis fans must provide adequate airflow to cool the first processor, or a fan must be attached directly to the heatsink. The boxed Pentium III Xeon processor's heatsink(this does not apply to heatsinks designed for the 866 MHz and greater processors) was designed to accommodate an auxiliary fan, if one is necessary. The heatsink has two "channels" into which the supplied grommets can be placed. A standard 40mm fan (with 36mm mounting hole spacing) or 50mm fan can be attached with screws provided with the processor. A fan attached to the heatsink face allows heat to be removed from the heatsink fins and evacuated into the chassis air. More information on the boxed Pentium III processor's heatsink and fan attach feature can be found in the Pentium® III Xeon® Processor Datasheet.
Figure 3: Boxed Pentium® III Xeon® Processor with Fan Positioned for Attachment
Follow the steps below to mount a fan:- Position the 40mm fan over the center of the heatsink with the fan mounting holes lined up over the grommet channels, as shown in Figure 3. If using a 50mm fan, position the fan diagonally over the upper grommet channel.
- Insert the grommets into the channel, using the fan mounting locations as a guide. The grommets should be positioned so they will expand into the heatsink fins when a screw is inserted into them.
- Position the fan over the grommets and secure with screws. Only two screws are necessary to attach one fan.
- Attach the fan power cable to the appropriate power source, which may be either a chassis power supply connector or a special fan power header on the motherboard.
Managing system airflow
The following are factors which determine system airflow:- Chassis design
- Chassis size
- Location of chassis air intake and exhaust vents
- Power supply fan capacity and venting
- Location of the processor slot(s)
- Placement of add-in cards and cables
Integrators use two basic motherboard-chassis-power supply form factors for servers and workstations: ATX variations and the older Server AT form factor. Due to cooling and voltage considerations, Intel recommends the use of ATX form factor motherboards and chassis for the boxed Pentium III Xeon processor.
The ATX form factor simplifies assembly and upgrading of systems, while improving the consistency of airflow to the processor. With regard to thermal management, ATX power supplies draw air in to the chassis rather than venting out system air. Also, on an ATX motherboard, the processor slot is located close to the power supply, rather than close to the front panel of the chassis. Because of these differences the airflow in ATX chassis usually flows from the back of the chassis, directly across the processor and out of the front, side and rear vents of the chassis. Figure 2 shows proper airflow through an ATX system. For the boxed Pentium III Xeon processor, chassis that conform to the ATX Specification Rev. 2.01 are highly recommended. For more information on the ATX form factor, please visit the ATX Web site*. A list of ATX chassis manufacturers can also be found on the ATX Web site.
Figure 4: System Airflow Through an ATX Tower Chassis (side view)
Server AT form factor motherboards are not recommended because such designs are not standardized for effective thermal management. However, some chassis designed exclusively for Server AT form factor motherboards may yield efficient cooling.
As mentioned before, the newly introduced WTX specification was created to standardize a new motherboard and chassis form factor, fix the relative processor location, and allow for high volume airflow through a portion of the chassis where the processors are positioned. This allows for standard form factor motherboards and chassis to be used to integrate processors with more demanding thermal management requirements. Integrators are encouraged to use WTX form factor motherboards and chassis when they are available in late 1999. More information on the WTX specification can be found at the WTX Web site at http://www.wtx.org*.
The following is a list of guidelines to be used when integrating a system.- Chassis vents must be functional and not excessive in quantity: Integrators should be careful not to select chassis that contain cosmetic vents only. Cosmetic vents are designed to look as if they allow air flow but little or no air flow actually exists. Chassis with excessive air vents should also be avoided. In this case, very little air flows over the processor and other components. In ATX chassis, I/O shields must be present. Otherwise, the I/O opening may provide for excessive venting.
- Vents must be properly located: Systems must have properly located intake and exhaust vents.The best locations for air intakes allow air to enter the chassis and directly flow over the processor. Exhaust vents should be situated so that air flows on a path through the system, over various components, before exiting. Specific location of vents depends upon the chassis. For ATX systems, exhaust vents should be located both in the bottom front and bottom rear of the chassis. Also, for ATX systems, I/O shields must be present to allow the chassis to vent air as designed. Lack of an I/O shield may disrupt proper airflow or circulation within the chassis.
- Power Supply Airflow Direction: It is important to choose a power supply that has a fan that draws air in the proper direction. For most ATX systems the power supply acts as an intake fan, drawing air into the system. Some power supplies have markings noting airflow direction.
- Power Supply Fan Strength: PC power supplies contain a fan. In ATX power supplies, the fan draws air into the chassis. If exhaust vents are properly located, the power supply fan can draw enough air for most systems. For some chassis where the processor is running too warm, changing to a power supply with a stronger fan can greatly improve airflow.
- Power Supply Venting: Most, if not all, air flows through the power supply unit, which can be a significant restriction if not well vented. Choose a power supply unit with large vents. Wire finger guards for the power supply fan offer much less airflow resistance than openings stamped into the sheet metal casing of the power supply unit.
- System Fan - Should It Be Used? Some chassis may contain a system fan (in addition to the power supply fan) to facilitate airflow. A system fan is typically used with passive heatsinks. In some situations, a system fan improves system cooling. Thermal testing both with a system fan and without the fan will reveal which configuration is best for a specific chassis.
- System Fan Airflow Direction: When using a system fan, ensure that it draws air in the same direction as the overall system airflow. For example, a system fan in an ATX system should act as an exhaust fan, pulling air from within the system out through the rear or front chassis vents.
- Protect Against Hot Spots: A system may have a strong airflow, but still contain "hot spots." Hot spots are areas within the chassis that are significantly warmer than the rest of the chassis air. Improper positioning of the exhaust fan, adapter cards, cables or chassis brackets and subassemblies blocking the airflow within the system, can create such areas. To avoid hot spots, place exhaust fans as needed, reposition full-length adapter cards or use half-length cards, re-route and tie cables, and ensure space is provided around and over the processor.
Performing thermal testing
Differences in motherboards, power supplies, add-in peripherals and chassis all affect the operating temperature of systems and the processors that run them. Thermal testing is highly recommended when choosing a new supplier for motherboards or chassis, or when starting to use new products. Thermal testing can determine if a specific chassis-power supply-motherboard configuration provides adequate airflow for boxed Pentium III Xeon processors. To begin determining the best thermal solution for your Pentium III Xeon processor based systems, contact your motherboard vendor for chassis and fan configuration recommendations.
Thermal sensor and thermal reference byte
The Pentium III Xeon processor has unique system management capabilities. One of these is the ability to monitor the processor's core temperature relative to a known maximum setting. The processor's Thermal Sensor outputs the current processor temperature and can be addressed via the System Management Bus (SMBus). A "thermal byte" (8-bits) of information can be read from the Thermal Sensor at any time. The thermal byte granularity is 1°C. The reading from the thermal sensor is then compared to the Thermal Reference Byte.
The Thermal Reference Byte is also available via the Processor Information ROM on the SMBus. This 8-bit number is recorded when the processor is manufactured. The Thermal Reference Byte contains a pre programmed value that corresponds to the thermal sensor reading when the processor is stressed to its maximum thermal specification. Therefore, if the thermal byte reading from the Thermal Sensor ever exceeds the Thermal Reference Byte, the processor is running hotter than the specification allows.
Thermal testing can be done by stressing each of the processors in a fully configured system, reading the thermal sensor of each processor, and comparing it to the thermal reference byte of each processor to determine if it is running within thermal specifications. Software that can read information off the SMBus is needed to read both the Thermal Sensor and Thermal Reference Byte.
Thermal test procedure
The procedure for thermal testing is as follows:
Note If you are testing a system with a variable-speed system fan, you must run the test at the maximum operating room temperature you have specified for the system. - To ensure maximum power consumption during the test, you must disable the system's automatic power-down modes or "green features." These features are controlled either within the system BIOS or by operating system drivers.
- Set up a method to record the room temperature, either with an accurate thermometer or thermocouple and thermal meter combination.
- Power up the workstation or server. If the system has been assembled properly, and the processor is properly installed and seated, the system boots into the intended operating system (OS).
- Invoke the thermally stressful application. (See the Thermally Stressful Applications section for more information.)
- Allow the program to run for 40 minutes. This allows the entire system to heat up and stabilize. Record the Thermal Sensor reading for each processor once every 5 minutes for the next 20 minutes. Record the room temperature at the end of the 1-hour period.
After recording the room temperature, power the system down. Remove the chassis cover.
Allow the system to cool at least 15 minutes.
Using the highest of the four measurements taken from the thermal sensor, follow the procedure in the following section to verify the systems thermal management.
Calculation to verify a system's thermal management solution
This section explains how to determine whether a system can operate at the maximum operating temperature while keeping the processor within its maximum operating range. The result of this process shows whether the system airflow needs to be improved or the system's maximum operating temperature needs to be revised in order to produce a more reliable system. (An example is provided at the end of this section.)
The first step is to select a maximum operating room temperature for the system. A common value for systems where air conditioning is not available is 40°C. A common value for systems where air conditioning is available is 35°C. Choose a value that is right for your customer. Write this value on line A below.
Write the room temperature recorded after testing on line B below. Subtract line B from line A and write the result on line C. This difference compensates for the fact that the test was likely conducted in a room that is cooler than the system's maximum operating temperature.
(Appendix A contains a table for converting between Fahrenheit and Celsius scales.)
A. _ _ _ _ _ (Maximum operating temperature, typically 35° C or 40° C)
B. - ______ _ Room temperature ° C at end of test
C. _ _ _ _ _
Write the highest temperature recorded from the thermal meter on line D below. Copy the number from line C to line E below. Add line D and line E and write the sum on line F. This number represents the highest thermal sensor reading for the processor core when the system is used at its specified maximum operating room temperature running a similarly thermally stressful application. This value must remain below the Thermal Reference Byte value. Write the Thermal Reference Byte reading on line G.
D. _ _ _ _ _ Maximum reading from thermal sensor
E. + _______ Max. operating temperature adjustment from line C above
F. _ _ _ _ _ Max. thermal sensor reading in a worst case room ambient
G. _______ Thermal Reference Byte reading
Processors should not be run at temperatures higher than their maximum specified operating temperature or failures may occur. Boxed processors will remain within thermal specification if the Thermal Sensor reading is less than the Thermal Reference Byte at all times.
Processors should not be run at temperatures higher than their maximum specified operating temperature or failures may occur. Boxed processors will remain within thermal specification if the Thermal Sensor reading is less than the Thermal Reference Byte at all times.
If line F reveals that processor core exceeded its maximum temperature, then action is required. Either the system airflow must be significantly improved, or the system's maximum operating room temperature must be lowered. If the number on line F is less than or equal to Thermal Reference Byte, the system will keep the boxed processor within specification under similar thermally stressful conditions, even if the system is operated in its warmest environment.
To Summarize:
If the value on line F is greater than the Thermal Reference Byte, there are two options:- Improve system airflow to bring the processor's fan inlet temperature down (follow the recommendations made earlier). Then retest the system.
- Choose a lower maximum operating room temperature for the system. Bear in mind the customer and the system's typical environment.
Thermally stressful applications
Some commercially available software applications will cause the processor to heat up and dissipate more power through the heatsink and into the system. These thermally stressful applications can be used during thermal testing to help ensure that typical processing loads are accounted for in the thermal management of the system. Software programs will affect each microprocessor architecture uniquely (with respect to power dissipation). Some cursory verification of the system under test can determine which software program provides the highest temperature in the system. Using this application to test can provide assurance that applications being run on the platform will not cause the system to exceed the desired temperature operating range.
Future applications may demand more processor power and therefore generate more heat in the system. Adding additional thermal headroom for possible future applications can provide additional confidence in the system management of a server or workstation. This would mean verifying that the temperature measured during the thermal test was below the target specification by a certain value. A typical value to allow for thermal headroom may be 5°C or 10°C.
Below is a list of some applications and software conditions that operate on some common operating systems. These applications will affect different processors differently, but can cause most processors to dissipate a reasonable amount of power (and heat). Again, evaluating several applications on a system will show which applications cause the highest temperatures to be reached. It is highly recommended that several applications be used to determine the worst case thermal condition for the processor and that thermal testing be done with the worst case thermal application. Some applications require specific set up options or scripts to be in place for continual operation. Make sure that the application will operate in a thermally stressful fashion throughout the duration of the test.
For multithreaded operating systems, one instance of the software should be run for each processor in the system. Typically, the operating system assigns each successive instance of software to a unique processor.
Table 2. Example Applications That May Dissipate More Processor Heat1
Operating System Application Name Software Setup DOS 6.22 Edit DOS Edit.com with the file menu pulled down (Alt-F) and left pulled down DOS 6.22 Quake* I ver 1.01 DOS 6.22 Heretic* Windows* 98 CPUMark32* Winbench98* suite Windows 98 3D Winmark* Winmark98* suite Windows* 98 SYSMark32* ver 1.0a BAPCO* Windows 98 Idle Screen saver disabled, nothing running Windows NT* 4.0 Prime95 ver 15.4.1 Windows NT 4.0 SPECint98* or SPECint95* Windows NT 4.0 SPECfp98* or SPECfp95* UnixWare* 2.01 Idle Waiting for user input at UNIX prompt UnixWare* 2.01 145.fpppp (SPECfp95)
- Other brands and names are the property of their respective owners.
- Evaluating several applications on a system will show which applications cause the highest temperatures to be reached.
Testing hints
Use the following hints to reduce the need for unnecessary thermal testing.- When testing a system that supports more than one processor speed, test using the processor(s) that generates the most power. Processors that dissipate the most power will generate the most heat. By testing the warmest processor supported by the motherboard you can avoid additional testing with processors that generate less heat with the same motherboard and chassis configuration.
Power dissipation varies with processor speed and silicon stepping. To ensure selection of the appropriate processor for your system thermal testing, refer to Table 1 for power dissipation numbers for boxed Pentium III Xeon processors. Boxed Pentium III Xeon processors are marked with a 5-digit test specification number, usually beginning with the letter S. Test specification numbers for a particular stepping of Pentium III Xeon processor can be found in the Pentium III Xeon processor table located in the Boxed Processor Test Specification Information document.
- Thermal checkout with a new motherboard is not necessary if all of the following conditions are met:
- The new motherboard is used with a previously tested chassis that worked with a similar motherboard.
- The previous test showed the configuration to provide adequate airflow.
- The processor is located in approximately the same place on both motherboards.
- A processor with the same or lower power dissipation will be used on the new motherboard.
- Most systems are upgraded (additional RAM, adapter cards, drives, etc.) sometime during their life. Integrators should test systems with some expansion cards installed in order to simulate a system that has been upgraded. A thermal management solution that works well in a system that is heavily loaded does not need to be re-tested for lightly loaded configurations.
Appendix A
The following table is provided to help convert degrees Fahrenheit to degrees Celsius.
Table 3. Fahrenheit to Celsius Conversions
° F ° C Notes ° F ° C Notes 59.0 15 118.4 48 60.8 16 120.2 49 62.6 17 122.0 50 64.4 18 123.8 51 66.2 19 125.6 52 68.0 20 127.4 53 69.8 21 129.2 54 71.6 22 Note 1 131.0 55 73.4 23 132.8 56 75.2 24 134.6 57 77.0 25 136.4 58 78.8 26 138.2 59 80.6 27 140.0 60 82.4 28 141.8 61 84.2 29 143.6 62 86.0 30 145.4 63 87.8 31 147.2 64 89.6 32 149.0 65 91.4 33 150.8 66 93.2 34 152.6 67 95.0 35 Note 2 154.4 68 96.8 36 156.2 69 98.6 37 158.0 70 100.4 38 159.8 71 102.2 39 161.6 72 104.0 40 Note 3 163.4 73 105.8 41 165.2 74 107.6 42 167.0 75 109.4 43 168.8 76 111.2 44 170.6 77 113.0 45 172.4 78 114.8 46 174.2 79 116.6 47 176.0 80
Note - Typical office room temperature
- Typical maximum operating room temperature for a system in an air conditioned environment
- Typical maximum operating room temperature for a system in a non air conditioned environment.
- Chassis fans can create high enough airflow through the chassis, or through the processors with ducting, to eliminate the need for localized airflow.
- Declarations of Conformity
-
The CE Declaration of Conformity is a document used in Europe which a manufacturer signs stating what certifications/standards a product will possess, achieve or follow. Information Technology Equipment including computers/computer components must follow the EMC Directive and the Low Voltage Directive.
Information on International Declarations of Conformity for processors regarding one or more of the following international regulatory requirements can be located on the page: International Declarations of ConformityRegulations covered by region:
- European Union - CE Marking
- USA - Safety certification, FCC compliance on EMC and ACTA technical standards
- Canada, Australia, New Zealand - EMC, safety specifications, Telecommunications Registrations
Other regions
In some other regions the listed standards may also demonstrate conformity.
For more details, or country specific approvals, consult the regional representative.
- Datasheets
-
The Pentium® III Xeon® processor at 700 MHz and 900 MHz, like the Pentium® Pro, Pentium® II, Pentium® II Xeon® and previous Pentium III Xeon processors, implements a Dynamic Execution micro-architecture, a unique combination of multiple branch prediction, data flow analysis, and speculative execution. The Pentium® III Xeon® processor at 700 MHz will be available in 1MB and 2MB L2 cache sizes whereas the Pentium® III Xeon® processor at 900 MHz will only be available in the 2MB L2 cache size.
Pentium® III Xeon® Processor at 700 MHz and 900 MHz 
File Name: 24871102.pdf
Size: 1121475 bytes
The Pentium® III Xeon® processor at 1 GHz, like the Pentium II Xeon processor and other Pentium III Xeon processors, implements a Dynamic Execution micro-architecture, a unique combination of multiple branch prediction, data flow analysis, and speculative execution. The Pentium III Xeon processor at 1 GHz is available in a 256K cache size.
Pentium® III Xeon® Processor at 600 MHz to 1 GHz with 256KB L2 Cache File Name: 24530504.pdf
Size: 1029617 bytes
The Intel® Pentium® III Xeon® processor is designed for mid-range to high-end servers and workstations, and is binary compatible with previous Intel Architecture processors. The Pentium III Xeon processor provides the best performance available for applications running on advanced operating systems such as Windows* 95, Windows NT, and UNIX*. The Pentium III Xeon processor is scalable to four processors in a multiprocessor system and extends the power of the Pentium Pro processor with new features designed to make this processor the right choice for powerful workstation, advanced server management, and mission-critical applications. Pentium III Xeon processor-based workstations offer the memory architecture required by the most demanding workstation applications and workloads. Specific features of the Pentium III Xeon processor address platform manageability to meet the needs of a robust IT environment, maximize system up time and ensure optimal configuration and operation of servers. The Pentium III Xeon processor enhances the ability of server systems to monitor, protect, and service the processor and its environment.
Pentium® III Xeon® Processor at 500 and 550 MHz File Name: 24509402.pdf
Size: 1979387 bytes
- Specification Updates
-
This document is an update to the specifications contained in the Intel® Pentium® III Xeon® Processor datasheets (Order Number(s) 248711, 245305 & 245904). This document is intended for hardware system manufacturers and software developers of applications, operating systems, or tools. It contains specification changes, S-specs, errata, specification clarifications, and documentation changes. The Pentium® III Xeon® processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
- Specification Changes are modifications to the current published specifications. These changes will be incorporated in the next release of the specifications.
- S-Specs are exceptions to the published specifications, and apply only to the units assembled under the S-spec.
- Errata are design defects or errors. Errata may cause the Intel® Pentium® III Xeon® processor's behavior to deviate from published specifications. Hardware and software designed to be used with any given stepping must assume that all errata documented for that stepping are present on all devices.
- Specification Clarifications describe a specification in greater detail or further highlight a specification's impact to a complex design situation. These clarifications will be incorporated in the next release of the specifications.
- Documentation Changes include typos, errors, or omissions from the current published specifications. These changes will be incorporated in the next release of the specifications.
The Specification Update should be publicly available following the last shipment date for a period of time equal to the specific product's warranty period. Hardcopy Specification Updates will be available for one (1) year following End of Life(EOL). Web access will be available for three (3) years following EOL.
Specification Update File Name: 24446043.pdf
Size: 430130 bytes
- System Will Not Boot After Upgrading Processor
-
After upgrading to a newer processor, such as to the Intel® Pentium® Processor E5000 Series or the Intel® Core™2 Duo Processor, the system will not boot:
Confirm with the manufacturer of the motherboard or computer that the board is validated for the processor frequency, stepping, and voltage. The stepping is the hardware revision, and it is possible to have processors at the same frequency but different steppings. Some steppings may not be compatible with your motherboard.
The BIOS on the motherboard may need to be updated to support the newer processor. The BIOS update files would be available from the system or board manufacturer.
When working within the computer case, cables and other pieces of hardware can be knocked loose. This applies to power cables for drives and fans, as well as for the ribbon cables for the disk drives. Make sure all cables are seated properly by either pressing them into place or removing them, one at a time, and reseating them. If this is a process you are not comfortable with, you may wish to contact an Intel® Premier Provider.
Your vendor, or a reputable local vendor, should also be able to test the processor in a compatible system.
Upgraded processor - The motherboard's BIOS needs to be able to identify the CPUID of the processor. Supported motherboards will have this information added in the newest BIOS release.
- Technical Notes
-
- Declarations of conformity
-
The CE Declaration of Conformity is a document used in Europe which a manufacturer signs stating what certifications/standards a product will possess, achieve or follow. Information Technology Equipment including computers/computer components must follow the EMC Directive and the Low Voltage Directive.
Information on International Declarations of Conformity for processors regarding one or more of the following international regulatory requirements can be located on the page: International Declarations of ConformityRegulations covered by region:
- European Union - CE Marking
- USA - Safety certification, FCC compliance on EMC and ACTA technical standards
- Canada, Australia, New Zealand - EMC, safety specifications, Telecommunications Registrations
Other regions
In some other regions the listed standards may also demonstrate conformity.
For more details, or country specific approvals, consult the regional representative.
- Intel® microprocessor export compliance metrics
-
Intel Corporation
2200 Mission College Blvd.
P.O. Box 58119
Santa Clara, CA 95052-8119
USAGlobal Trade Department
e-mail inquiries to: ctp.determinations@intel.comFollowing are the Gigaflops (GFLOPS), Composite Theoretical Performance (CTP), and Adjusted Peak Performance (APP) values for Intel’s 32-bit and 64-bit processors. All Intel® 8-bit and 16-bit processors and microcontrollers with a clock speed exceeding 25 MHz are 3A991, with the exception of those encapsulated in military packages that have been tested to the Mil-883C temperature specifications. All Intel 8-bit and 16-bit processors and microcontrollers with a clock speed of 25 MHz or less are EAR99.
On November 5, 2007, the United States Department of Commerce’s Bureau of Industry and Security (BIS) published amendments to the Export Administration Regulations 15 CFR, which resulted in the inclusion of the December 2006 Wassenaar Arrangement Plenary Agreement Implementation.
The amendments introduced a new metric, Gigaflops (GFLOPS), to measure processor performance for export purposes. BIS no longer requires exporters to determine the CTP. However, CTP values will still be provided for those customers located in countries where the CTP is still required as a measurement of processor performance for export compliance purposes.
CTP calculations are based upon a modified formula resulting from Wassenaar negotiations on December 21, 1993, and published in the United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4), and are stated in Millions of Theoretical Operations Per Second (MTOPS).
APP calculations are based on the formula published in the United States Department of Commerce Export Administration Regulations 71 CFR 20876, and are stated in Weighted Teraflops (WT).
All GFLOPS, CTP and APP calculations contained herein were based on specifications taken from Intel datasheets and are subject to change without notice. Intel makes no representation or warranty as to the accuracy or reliability of such specifications. THESE CALCULATIONS ARE PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. Intel disclaims all liability, including liability for infringement of any proprietary rights, relating to use of information in these calculations. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
- These products are no longer supported via phone, e-mail, or chat
-
The following older processor families are no longer supported through interactive support such as phone, e-mail, or chat.
Intel will maintain information for these processors on our web site. You can access these processor family Web sites by clicking on the links under the processor column.
Processor End of interactive support (EOIS) Additional description Mobile Intel® Pentium® 4 Processors - M November 8th, 2008 All Intel® Processor Frequency ID Utility November 8th, 2008 All Intel® Pentium® Processors Extreme Edition November 8th, 2008 All Intel® Pentium® D Processors November 8th, 2008 All Intel® Pentium® 4 Processors Extreme Edition November 8th, 2008 All Intel® Pentium® 4 Processors Extreme Edition supporting HT Technology November 8th, 2008 All Intel® Pentium® 4 Processors November 8th, 2008 All Intel® Celeron® D Processors November 8th, 2008 All Intel® Celeron® Processors November 8th, 2008 All 478-pin package December 1st, 2004 All FCPGA & FCPGA2 packages December 1st, 2004 All 370-pin package June 14th, 2002 All PPGA & SEPP packages Still supported [E3000, E1000 & 400 Series are still supported] Intel® Pentium® III Xeon® Processors December 1st, 2004 All Intel® Pentium® III Processors December 1st, 2004 All Mobile Intel® Pentium® III Processors December 1st, 2004 All Intel® Pentium® II Xeon® Processors June 14th, 2002 All Intel® Pentium® II Processors June 14th, 2002 All Mobile Intel® Pentium® II Processors December 1st, 2004 All Intel® Pentium® Pro Processors October 17th, 2000 All Intel® Pentium® Processors with MMX™ Technology October 17th, 2000 All Intel® Pentium® Processors October 17th, 2000 All Intel® Pentium® Mobile Processors October 17th, 2000 All Intel® OverDrive® Processors October 17th, 2000 All Intel486™ Processors December 1st, 2004 All Intel386™ Processors December 1st, 2004 All
- Floating Point Unit (FPU) exception handlers for Intel® Architecture (IA)
-
Floating Point Unit (FPU) exception hander information for Intel® processors is available in the following documents:
Application note AP-578, Software and Hardware Considerations for FPU Exception Handlers for Intel® Architecture Processors, Intel® Document #243291. This application note provides information to help software engineers write the most robust Floating-Point Unit (FPU) exception handlers possible.
Also see the Intel® Pentium® Processor Family Developer's Manual, Volume 3, Intel® Document #241430, contains three chapters about programming the floating point unit, including one chapter dedicated to programming examples.
Also see the Intel® Architecture Software Developer's Manual, Volume 1: Basic Architecture, Intel® Document #243190, Chapter 7 and Appendix C.
- What mode of addressing do the Intel® Processors use?
-
Intel® processors since the Intel386™ processor can run one of three modes. They are the Real mode, Protected mode and SMM mode. You can also add a fourth mode called Virtual 8088 mode, which is considered a pseudo mode of the protected mode.
When the processor starts booting the computer, the processor starts in real mode where it operates like a 8086 processor that can see up to 1 MB of RAM.
The native mode for the processor is the Protected mode which it will switch into while it loads Windows* or some other advanced operating system. While in protected mode, the processor uses segmented (non-linear) addressing, as opposed to linear addressing.
Segmented addressing means that memory (physical memory and virtual memory) is divided into 64K blocks. This is the maximum value for the Instruction Pointer (IP) register. The IP register works with the Code Segment (CS) register to point to the memory location from where the microprocessor should fetch its next instruction. The IP uses 4 bytes for memory addressing, therefore making 0FFFFH the maximum memory location (0FFFFH = 64K).
- Installation and Use
-
- Installation manual
-
The installation manuals and flyers for boxed processors are now available in 11 languages: English, Traditional Chinese, Simplified Chinese, Korean, French, Italian, German, Spanish, Portuguese, Russian, and Japanese.
The localized language versions are bundled together in one self-extracting .exe file. To get a specific language, you will need to download the bundled .exe file to your hard drive, and then double click on it to extract the individual language versions.
English:
Installation Manual [PDF] File Name: p3xpman1.pdf
Size: 406,528 bytes
Date: November 5, 1999
All Languages:
Installation Manual [EXE] File Name: p3xp11.exe
Size: 8,522,240 bytes
Date: November 5, 1999
- Installation flyer
-
The installation flyer for boxed processors is available in English.
English:
Installation Flyer [PDF] File Name: p3xp733fly1.pdf
Size: 10,240 bytes
Date: November 15, 1999
File Revision: A02555-001
- Integration notes
-
Updated November 2001 This overview is for professional system integrators building workstations and mid range and higher servers with Intel® Pentium® III Xeon™ processors and industry-accepted motherboards, chassis, and peripherals. For information on the Intel® Pentium II Xeon™ processor, see the Integration Overview for Intel Pentium II Xeon Processor-Based Systems. 
Pentium® III Xeon™ Processor Features The Pentium III Xeon processor is part of the new Intel Inside® microprocessor family designed exclusively for today's powerful servers and workstations. Building on the architecture of the Pentium II Xeon processor, the Pentium III Xeon processor adds the superior performance of Internet Streaming SIMD Extensions.
Powering Servers and Workstations to New Levels of Performance
Internet Streaming SIMD Extensions includes 70 new instructions that accelerate the performance of today's performance-demanding workstation applications, including CAD, digital content creation, 3D modeling, and real-time physics simulation. Servers using the Pentium III Xeon processor deliver outstanding performance for net connectivity, database processing, and file compression/decompression. The Pentium III Xeon processor delivers industry leading performance from its larger and faster L2 caches, multiprocessing capabilities and a 133- or 100- MHz system bus. Systems based on the Pentium III Xeon processor are scalable, with support for:- Up to two processors using "glueless" multiprocessing capabilities for processors using a 133-MHz system bus
- Up to four processors using "glueless" multiprocessing capabilities for processors using a 100-MHz system bus
- Larger than four-way systems using advanced chipsets or clustering technologies like NUMA and VI architecture for processors using a 100-MHz system bus
- Support for 64B of system memory using expanded 36-bit addressing
Core Speeds (MHz) 10002 9332 900 8662 800 733 700 667 600 550 500 0.18 Micron Process Technology X X X X X X X X X 0.25 Micron Process Technology X X 256KB Full-Speed L2 Cache X X X X X X X 512KB Full-Speed L2 Cache X X 1MB Full-Speed L2 Cache X X X 2MB Full-Speed L2 Cache X X X X 133-MHz System Bus X X X X X X X 100-MHz System Bus X X X X Dual-Processing Capability X X X X X X X X X X X 4-Way Processing Capability X X X1 X1 Integrated System Management
Features via the System Management
Bus (SMBus)X X X X X X X X X X X Streaming SIMD Extensions X X X X X X X X X X X Intel Processor Serial Number X X X X X X X X X X X Dual Independent Bus Architecture X X X X X X X X X X X Dynamic Execution Technology X X X X X X X X X X X Intel MMX™ Media-Enhancement
TechnologyX X X X X X X X X X X 1Note Some versions of the Boxed Pentium III Xeon processor have been tested only in systems based on the Intel 82440GX AGPset. These processors have unique test specification numbers. To identify these processors, see the Pentium III Xeon processor table located in Product Specifications and Comparisons. 2Note Currently validated with the Intel® SBT2 Server Board only. Boxed Pentium III Xeon Processor Contents - 1 GHz, 933 MHz, 866 MHz, 800 MHz, 733 MHz, 700 MHz, 667 MHz, 600 MHz, 550 MHz, or 500 MHz processor
- Attached Passive Heatsink
- Certificate of Authenticity
- Intel Inside® Logo Sticker
- 3-year Limited Warranty
Motherboard Selection Motherboards used with Pentium III Xeon processors must meet Intel's published processor specifications. Motherboards that support the Pentium II Xeon processor may also support the Pentium III Xeon processor. Consult your motherboard manufacturer to ensure compatibility with the Pentium III Xeon processor. Motherboards used with the Pentium III Xeon processor 1 GHz, 933 MHz, 866 MHz, 800 MHz, 733 MHz, 667 MHz, or 600 MHz must support a 133 MHz system bus. Motherboards based on Intel's 840 AGPset should support a 133-MHz system bus.
In addition, motherboards used with the Pentium III Xeon processor 700 MHz, 550 MHz or 500 MHz must support a 100 MHz system bus. Motherboards based on Intel's 82440GX and 82450NX chipsets should support a 100 MHz system bus.Note 133 MHz system bus based Pentium III Xeon processors have only been validated for use in single or dual-processor motherboards.
Motherboards must be able to accommodate the processor's BIOS and electrical requirements. For BIOS compatibility, consult your motherboard manufacturer to ensure the board includes proper BIOS support for the Pentium III Xeon processor. The Pentium III Xeon processor's electrical requirements may be more stringent than those for the Pentium II Xeon processor. Consult your motherboard manufacturer to ensure your board meets the electrical requirements of the Pentium III Xeon processor. Intel offers five boxed platforms (motherboard and chassis) for system integrators building systems using the 100 MHz system bus based Pentium III Xeon processors: the SC450NX, the C440GX+, the SPKA4, and the SRKA4. There is also one boxed platform using the 133 MHz system bus based Pentium III Xeon processors: the SBT2. These platforms meet all of the Pentium III Xeon processor system bus, BIOS, and electrical requirements mentioned above (see individual product pages for supported processors). To build multiple processor systems, integrators are encouraged to choose a motherboard from a vendor that has a history of producing quality dual- or quad-processor motherboards. If you may need to mix processor steppings, consult your motherboard vendor for compatibility information.Note Some versions of the Boxed Pentium III Xeon processor have been tested only in systems based on the Intel 82440GX AGPset. These processors have unique test specification numbers. To identify these processors, see the Pentium III Xeon processor table located in the Product Specifications and Comparisons tool document. Chassis Selection Selection of a proper chassis is a very important consideration - particularly to ensure that proper venting and good airflow are present so that the processor does not exceed its thermal limits. Your motherboard manufacturer may have recommendations for a chassis that provides an effective cooling solution with your particular motherboard. Chassis may need additional fans to ensure good airflow through the system. See the section entitled Thermal Management Considerations for more guidelines on selecting the appropriate chassis and performing thermal testing for your particular motherboard. Integrators are encouraged to choose a chassis that will allow them to meet the thermal requirements of the processor. For assured compatibility, Intel's two boxed motherboards supporting the Pentium III Xeon processor, the C440GX, and the SBT2, can be purchased complete with a chassis that will accommodate the motherboard. These motherboard/chassis combinations have shown to provide an effective cooling solution for all system components, including the processor, in a typically loaded configuration. 
Processor Connector Requirements Motherboards supporting the Pentium III Xeon processor feature a 330-contact slot connector (previously called Slot 2) into which the processor is inserted. Processors using a 330-contact slot connector permit a closely coupled, high speed L2 cache, high-frequency signal integrity, and headroom for processor technology evolution. Motherboards with more than one 330-contact slot connector may come with a termination card. For proper operation, this termination card must be inserted into any slot not occupied by a processor. Motherboards using a Pentium III Xeon processor require a mechanical support for the processor called a retention mechanism. The retention mechanism holds the processor securely in the 330-contact slot connector and protects the processor and motherboard from damage. Motherboards with a dual processor design may require a dual retention mechanism. The single or dual retention mechanism is not included with the Boxed Pentium III Xeon processor. Your motherboard supplier should provide the single or dual retention mechanism, along with installation instructions. (All Intel boxed motherboards that support the 330-contact slot connector include an appropriate retention mechanism.) Figure 1 shows a second processor being installed in a dual retention mechanism.
Figure 1. Second Pentium III Xeon Processor and Heatsink Being Installed into a Dual Retention Mechanism Electrical Requirements The Pentium III Xeon processor core and L2 cache may operate at different voltages, and each has different current requirements. The core and L2 cache are specified to operate at the following voltages and currents: Boxed Pentium III Xeon Processor Electrical Specifications1Core voltage for 600 MHz and higher with 133 MHz system bus can be either 5V or 12V. Current values in the table are maximum values, assuming the core voltage is at its tolerated minimum. Pentium III Xeon processors 600 MHz and higher contain an On-Cartridge Voltage Regulator (OCVR). Intel manufactures two versions of the Pentium III Xeon processor with OCVR - one with a 2.8V input, and one with a 5V/12V input. The boxed Pentium III Xeon processors 600 MHz and higher with a 133 MHz system bus can accept either a 5V or 12V input at its core voltage pins. For these processors, the core VID pins are disabled in order to turn off the voltage regulator in motherboards that do not support the processor. Also, since the L2 cache is integrated on-die, the cache VID pins are set to 11111, which disables any motherboard-based L2 cache voltage regulator, which is no longer needed. Ensure that your motherboard specifically supports the 5V/12V version of the Pentium III Xeon processor before installing the processor. For Pentium III Xeon processors 550 MHz and lower and the 700 MHz, proper core and L2 cache voltages must be supplied for reliable operation. In order to support the different voltages and currents, the processor contains five voltage identification pins for the core and five for the L2 cache. Ideally, two separate voltage regulators are needed, one for the core and one for the L2 cache. These voltages may be supplied by regulators integrated in the motherboard or by voltage regulator modules (VRMs) installed on the motherboard in VRM headers. Voltage regulators must also be able to supply the appropriate current for the core and L2 cache. Intel strongly recommends the use of voltage regulators that meet the VRM 8.3 specification. Some voltage regulators may be able to supply the appropriate voltages, but are not rated to supply the appropriate current. Consult your motherboard manufacturer to ensure your motherboard can accommodate the current and voltage requirements of your processor. If the motherboard has VRM 8.3 headers, then a VRM must be installed in each header to power the associated processor's core or L2 cache. Most VRMs are VID-programmable. If your motherboard has fixed-voltage VRMs, the output voltages must match the processor core or L2 cache voltage requirements. Since the operating voltages of Pentium III Xeon processors (both core and L2 cache) may be changed as the processor goes through stepping changes, VID-programmable voltage regulators, whether integrated or in VRM headers, are the preferred solution.Processor Frequency (MHz) and L2 Cache Size Processor Core Voltage, Current1 L2 Cache Voltage, Current Voltage Tolerance 500/512KB 2.0V, 14.0A 2.7V, 3.4A ± 0.085V 500/1MB 2.0V, 14.0A 2.0V, 14.0A ± 0.085V 500/2MB 2.0V, 14.0A 2.0V, 6.0A ± 0.085V 550/512KB 2.0V, 15.4A 2.0V, 3.5Av ± 0.085V 550/1MB 2.0V, 15.4A 2.0V, 3.5A ± 0.085V 550/2MB 2.0V, 15.4A 2.0V, 6.3A ± 0.085V 600/256KB 5V, 5.3A
12V, 2.2AN/A
N/A± 0.25V
± 0.6V667/256KB 5V, 5.7A
12V, 2.4AN/A
N/A± 0.25V
± 0.6V700/1MB 2.8V, 13.9A N/A ± 0.085V 700/2MB 2.8V, 13.9A N/A ± 0.085V 733/256KB 5V, 6.0A
12V, 2.5AN/A
N/A± 0.25V
± 0.6V800/256KB 5V, 6.6A
12V, 2.7AN/A
N/A± 0.25V
± 0.6V866/256KB 5V, 7.5A
12V, 3.2AN/A
N/A± 0.25V
± 0.6V933/256KB 2.8V, 17 A
5V, 10.3 A
12V, 4,3 AN/A
N/A
N/A± 0.085V
± 0.250V
± 0.600V866/256KB 5V, 7.9A
12V, 3.3AN/A
N/A± 0.25V
± 0.6VV1000/256KB 5V, 7.9A
12V, 3.3AN/A
N/A± 0.25V
± 0.6V Thermal Management Considerations The table below shows the maximum operating temperatures for Pentium III Xeon processors, measured at the center of the processor's thermal plate beneath the heatsink: Boxed Pentium III Xeon Processor Thermal SpecificationsProcessor Frequency (MHz) and L2 Cache Size Processor Stepping Max. Operating Temp. in °C Total Max Processor Power in Watts 500/512KB C0 75 36.0 500/1MB C0 75 44.0 500/2MB C0 75 36.2 550/512KB C0 68 34.0 550/1MB C0 68 34.0 550/2MB C0 68 39.5 600/256KB A2 55 21.6 667/256KB A2 55 23.9 700/1M A1 65 32.0 700/2M A1 65 32.0 733/256KB A2 55 26.2 800/256KB A2 55 28.5 866/256KB B0 55 30.8 900/2MB (2.8 V) B0 65 39.3 900/2MB (5V/12V) B0 65 40.8 933/256KB B0 55 33.2 1000/256KB C0 55 34.6 You must use a chassis that provides sufficient airflow to keep the processor under its maximum operating temperature in the warmest user environment. Running the processor above its maximum temperature specification will void the warranty and can lead to functional and performance degradation.
Motherboard configurations (processor connector location and orientation) vary and have a great impact on your choice of chassis. Contact your motherboard manufacturer for recommendations for chassis that provide an efficient cooling solution for your particular motherboard. Your cooling solution may also require additional chassis fans, and in some cases, retention mechanism fans.
Generally, Intel recommends the use of ATX 2.01-compliant motherboards and chassis or the new WTX form factor motherboards and chassis for efficient cooling.
Be aware that the airflow in non-ATX 2.01-compliant chassis varies significantly-depending on venting, internal brackets and other factors. Chassis with low airflow can cause processors to run warmer than their maximum specification.
Thermal evaluation should always be performed when selecting a chassis for Pentium III Xeon processor-based systems. The Pentium III Xeon processor has a Thermal Sensor and Thermal Reference Byte, both of which can be accessed via the processor's System Management Bus (SMBus). A thermal byte (8-bit number) can be read from the Thermal Sensor and compared to the Thermal Reference Byte to determine if the processor's cooling solution and environment are adequate. The Thermal Reference Byte contains a reference number that corresponds to the thermal byte reading when the processor's thermal plate temperature is at its maximum rating.
The passive heatsink on the boxed Pentium III Xeon processor (this does not apply for the special heatsinks produced for 866 MHz and greater) contains features that allow attachment of a standard 40mm auxiliary fan (with 36mm mounting hole spacing) or 50mm auxiliary fan to the heatsink face, providing a flexible cooling solution. This flexible solution allows processors in chassis environments with high localized airflow to use only the passive heatsink, and for processors in less efficient environments to be cooled with an optional attached fan. An auxiliary fan is not included with the boxed Pentium III Xeon processor, but can be purchased from most electronic parts suppliers. The boxed Pentium III Xeon processor ships with grommets and screws that allow an auxiliary fan to be attached to the heatsink face. Thermal analysis, as described above, should be done to determine the best cooling solution for each processor in your system.
Figure 2: Boxed Pentium® III Xeon™ Processor
With Optional Auxiliary Fan Being Attached Dual and Multi-Processor System Considerations In addition to single-processor use, the Pentium III Xeon processor is designed for dual and multiprocessor operation. Pentium III Xeon processors based on a 133-MHz system bus have been validated to work only in a single- or dual-processor configuration. Pentium III Xeon processors based on a 100-MHz system bus is designed for up to 4-way processing.
Pentium III Xeon processors are tested during manufacturing to ensure they will work in configurations with multiple processors of the same speed and same L2 cache sizes. While operation with different speed processors and different L2 cache sizes is not prohibited, it is not tested by Intel and could have implications when running with operating systems that support multiprocessing. Intel tests multiprocessor configurations with different steppings of the Pentium III Xeon processor as new processor steppings are introduced. Certain Pentium III Xeon processors of the same speed but different steppings can be mixed in multiprocessor configurations. Recommendations for Integration of Dual and Multiprocessor Systems:Note Some versions of the Boxed Pentium III Xeon processor have been tested only in systems based on the Intel 82440GX AGPset. These processors have unique test specification numbers. To identify these processors, see the Pentium III Xeon processor table located in the Product Specifications and Comparisons tool document. - Ship multiprocessor systems with all processor slots populated to ensure that processor speeds, steppings, and L2 cache sizes are the same. When partially populated systems are shipped, customers attempting to install additional processors may have difficulty locating them with the same stepping or cache sizes. In these cases, they may have to replace the original processor to obtain a system with processors of the same stepping.
- If a system is shipped without all processors installed, test the system first with all processor slots populated. This will demonstrate whether the motherboard supports multiprocessor operation. You should also provide these customers with speed and stepping information for the original processor. This will ensure they understand the importance of having processors of the same speed, stepping, and cache size. It also warns them of the risk of having to replace the original processor in the future if earlier stepping processors are not available.
- If a system is shipped without all processors installed, make sure to install the appropriate termination card(s) in any vacant SC-330 connectors. Termination cards should be supplied with your dual- or quad-processor motherboard, or can be obtained from your motherboard vendor. All AGTL+ system bus signals must be terminated at each processor, so a vacated SC-330 connector must be populated with a termination card to maintain proper system bus termination.
Note Termination cards for 133-MHz system bus based boards may differ from those for 100-MHz system bus based boards. Do not use termination cards interchangeably between boards. Consult your motherboard vendor for a termination card designed specifically for your motherboard. - If a system is shipped without all processors installed, install the operating system with all processors installed. Some operating systems will install different kernel versions, depending on the number of processors present. Once the operating system has been installed the remaining processors can be removed before system shipment. This alleviates the need to reinstall the operating system if more processors are added later. Make sure to populate all open processor connections with appropriate termination cards, which should have been supplied with your motherboard.
The easiest way to match steppings is to compare the 5-character test specification numbers on the top of Pentium III Xeon processors. The number starts with an "S" and is followed by 4 characters (for example, "SL2RH"). Boxed Pentium III Xeon processors have the test specification number also printed on the package label. Identical silicon steppings may sometimes be shipped with different test specification numbers-depending on whether they are for OEMs or for system integrators. Some Intel boxed processors may have OEM test specification numbers. Boxed Pentium III Xeon Processor Silicon Test Specification vs. OEM Test Specification
Test specification numbers for the Pentium III Xeon processor can be found in the Pentium III Xeon processor table located in the Product Specifications and Comparisons tool. Mixing Processor Steppings and Speeds Intel Corporation fully supports mixed steppings of Pentium III Xeon processors. The following list describes the requirements to support mixed steppings: - Mixed steppings are only supported with processors that have identical family and model numbers as indicated by the CPUID instruction.
- While Intel has done nothing to specifically prevent processors operating at differing frequencies from functioning within a multiprocessor system, there may be uncharacterized errata that exist in such configurations. Intel does not support such configurations. In mixed stepping systems, all processors must operate at identical frequencies (i.e., the highest frequency rating commonly supported by all processors).
- While there are no known issues associated with mixing of processors with differing cache sizes in a multiprocessor system, and Intel has done nothing to specifically prevent such system configurations from operating, Intel does not support such configurations since there may be uncharacterized errata that exist. In mixed stepping systems, all processors must be of the same cache size.
- While Intel believes that certain customers may wish to perform validation of system configurations with mixed frequency or cache sizes, and that those efforts are an acceptable option to our customers, customers would be fully responsible for the validation of such configurations.
- The workarounds identified in the latest specification update must be properly applied to each processor in the system. Certain errata are specific to the multiprocessor environment and are identified in the Mixed Stepping Processor Matrix, found in the Product Specifications and Comparisons tool. Errata for all processor steppings will affect system performance if not properly worked around. See the Pentium® III Xeon™ Processor Specification Update for details on processors that are affected by specific errata.
- In mixed stepping systems, the processor with the lowest feature-set, as determined by the CPUID Feature Bytes, must be made the Bootstrap Processor (BSP). In the event of a tie in feature-set, the tie should be resolved by selecting the BSP as the processor with the lowest stepping as determined by the CPUID instruction. You motherboard BIOS should automatically perform this selection process. Contact your motherboard vendor if you have questions regarding your motherboard meeting this requirement.
- Choose a motherboard vendor with a history of quality and dual and multiprocessor experience to minimize potential system-level issues.
- Contact your motherboard vendor for information on mixed stepping validation performed on your particular dual or multiprocessor motherboard.
- Refer to the General Information section of the Pentium III Xeon Processor Specification Update for the latest information on mixed steppings. The specification update also contains information on processor errata, their workarounds and potential performance issues. The specification update can also be obtained from Intel literature at 1-800-548-4725.
- Computer does not boot (has lights and/or fans, no monitor activity)
-
Symptom:
- No boot
- Fan activity
- Lights
- No monitor activity
Symptom:
Important Note: Only a computer professional should assemble, disassemble, upgrade, or troubleshoot computers since the electronic devices may cause serious damage to the installer, the system, or its components if these actions are done improperly. Before attempting to disassemble or assemble computers, install components in a computer or troubleshoot computers, carefully review the documentation specific for the computer and its related components. Lastly, make sure to follow procedures to prevent damage from Electrostatic Discharge (ESD).
- Determine if the system worked before. Determine if there have been any recent changes. Often if a recent change is been made, the recent change is the cause of the problem.
- Make sure that the monitor is plugged in and that the monitor is on.
- Make sure that the video cable is connected properly at the monitor and the PC.
- Determine if there is power light on the monitor. Most monitors will have a green light indicating it has sufficient power and is getting a video signal and an amber light if it has power but it is not getting a video signal from the computer. If you have no lights, it is most likely a problem with the monitor. Make sure that the monitor is connected to a working AC outlet, the AC power cord is plugged into the wall outlet and the monitor. If you have any on/off switches for the outlet, make sure that the switches are on. If the problem still persists, try replacing the monitor and try the monitor on another AC outlet and another system. If you have an amber light, it is most likely a problem with the computer.
- Check the brightness and contrast controls on the monitor. The monitor might be dimmed where you cannot see anything on the monitor.
- If you have a light on the monitor, use a voltmeter or an AC wall outlet tester found in a hardware store to confirm that there is adequate AC voltage at the wall outlet for the computer.
- If your AC outlet for your computer is connected to an on/off outlet switch, make sure that it is on.
- Ensure the selected motherboard is appropriate for the processor model, frequency, and stepping you are planning to use. For more information, refer to the Motherboard Selection and Voltage Requirements section of the Integration Overview document.
- Verify that your chassis/case and power supply is appropriate for the processor model and frequency and the motherboard you are planning to use.
- Verify that the power supply has the capacity to power all the devices used in your system. It is recommended to use at least a 200 W power supply, but may require a power supply with a higher capacity depending on the number of devices and the type of devices connected to your computer.
- Make sure the drive ribbon cables inside the computer are attached correctly and secure. Be sure to check the orientation of pin 1 of Hard Drive. If the ribbon cable is connected backwards may cause the computer not to power up.
* Check for foreign objects such as screws that may ground the motherboard and make sure the screws that hold the motherboard are not too tight.
- Check the cables that connect from the case to the motherboard. Be sure to include the power switch (PWR SW) and power LED (PWR LED). Refer to the motherboard manual for more information.
- Use a voltmeter to verify that each output from the power supply is correct. If any output is very low (especially the +5 volt output, replace the power supply).
- Use a voltmeter to verify the PowerGood signal is +5 volts. If the signal is below 1.0 volts, there may be a short or overload causing a constant reset. Consider replacing the power supply.
- Check for shorts and overloads inside computer by removing nonessential items such as extra controller cards and IDE/ATAPI devices and turning the computer on to see if it starts to boot. Leave the motherboard, power supply, RAM or processor. If the problem goes away, there was a short or overload with one of the components that you just removed or one of those components is faulty. Replace each of those one at a time until you isolate which is causing the problem. If the problem still occurs after removing the nonessential components, the problem has to be with the motherboard, power supply, RAM or processor.
- Remove the processor and RAM and reinstall them to make sure that they are installed correctly.
- Make sure that you have mounted the motherboard correctly with the spacers/stand-offs. In addition, make sure that when you insert the screws to tighten the motherboard into place, make sure not to tighten the screws too much.
- Determine if motherboard/system has any security features, which would disable boot.
- If you are using RDRAM, make sure that all memory sockets of a channel are filled with either a memory chip or a continuity module. In addition, if the motherboard has multiple channels, make sure that you fill the first channel once and that you check to see which memory sockets go with each channel. Lastly, the RDRAM often has to be installed in pairs of the same type of memory chips. For example, you would have to install two sticks of 64 MB of RDRAM running at 800 MHz.
- If you are using SDRAM or DDR-SDRAM, some motherboards require you to populate the memory sockets starting with the first socket. Refer to your motherboard documentation for more information.
- If the problem still persists, swap the RAM with known good RAM. In addition, test the suspected RAM in another known working system.
- If the problem still persists, swap the processor with a known good processor. In addition, test the suspected processor in another known working system.
- If the problem still persists, swap the motherboard with a known good motherboard. In addition, test the suspected motherboard in another known working system.